IeMRC Workshop on 'System in Package' - TWI, Cambridge, UK
12th December 2007

Workshop Agenda

 sip workshop

Event write up

Introduction to TWI - Roger Wise, Technology Group Manager TWI Ltd

IeMRC & its Advanced Packaging related activities - Martin Goosey, IeMRC Industrial Director

Recent developments and future trends in SiP and embedded passive technologies - David Peddar, TWI Ltd

Design for reliability for SiP - Stoyan Stoyanov, Greenwich University
Reliability & embedded test engineering for SiP technologies - Andrew Richardson, Lancaster University
Future trends in SiP for medical and related applications - Piers Tremlett, ZARLINK Semiconductor
Fatigue properties of SiP solder joints - Davide di Maio, NPL

Simulation & design route development for ADEPT-SiP - Alaa Abunjaileh, University of Leeds

 

IeMRC@lboro.ac.uk - ©2007 IeMRC

  

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